SK Hynix unveils iHBM integrated cooling for next-gen HBM products
SK Hynix has introduced iHBM, a new integrated cooling technology for high bandwidth memory products. This innovation reduces thermal resistance by over 30%, addressing heat issues critical for AI chips. The company aims to enhance performance and reliability in next-generation memory solutions without requiring complete system redesigns.
- ▪SK Hynix's iHBM technology embeds cooling elements directly within memory packages.
- ▪The new cooling solution significantly reduces thermal resistance compared to traditional methods.
- ▪Following the announcement, SK Hynix shares increased by over 6%, surpassing the 2 million won mark.
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SK Hynix unveils iHBM integrated cooling for next-gen HBM products The memory giant's new silicon-based cooling tech cuts thermal resistance by 30%, targeting the AI chip bottleneck that matters most: heat. Share Add us on Google by Editorial Team May. 26, 2026 window.sevioads = window.sevioads || []; var sevioads_preferences = []; sevioads_preferences[0] = {}; sevioads_preferences[0].zone = "01f21ccf-2092-46b1-9ac7-8c44cc782e0f"; sevioads_preferences[0].adType = "native"; sevioads_preferences[0].inventoryId = "c5700508-581b-472c-8fdd-a931cdbfc8e1"; sevioads_preferences[0].accountId = "1e47efc1-ec2d-4fca-a8b9-354e249e5095"; sevioads.push(sevioads_preferences); SK Hynix just embedded the air conditioning directly into the memory chip.
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