Samsung Galaxy S27 could bring a major Exynos upgrade
Samsung is planning a significant upgrade to its Exynos chips with the upcoming Galaxy S27, aiming to improve performance and thermal management. The Exynos 2700 is expected to adopt a side-by-side (SBS) design, moving DRAM next to the SoC instead of stacking it, which should reduce heat and latency. This follows incremental improvements seen in the Galaxy S26's Exynos 2600, which used a heat sink integration to combat overheating. Despite progress, Exynos still lags behind Qualcomm’s Snapdragon in efficiency and performance.
- ▪The Galaxy S26's Exynos 2600 marked a notable improvement over previous generations with better thermal control thanks to a Heat Path Block.
- ▪The Exynos 2700 in the Galaxy S27 is expected to use an SBS (side-by-side) design to separate DRAM from the SoC, improving cooling and performance.
- ▪Separating memory from the processor reduces thermal density and shortens signal paths, lowering latency and boosting efficiency.
- ▪Despite improvements, the Exynos 2600 still trails the Snapdragon 8 Elite Gen 5 in both thermal performance and raw power.
- ▪Samsung aims to close the gap with future Exynos chips by focusing on innovative thermal and architectural design changes.
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