Huawei's new stacking tech for high-capacity SSDs
Huawei has developed high-capacity SSDs using its proprietary Die-on-Board (DoB) technology, achieving up to 122 TB without access to the latest 3D NAND from US suppliers. This innovation allows for greater capacity density and reduced costs compared to traditional packaging methods. The company aims to compete with mainstream SSD suppliers by producing SSDs with impressive performance metrics and future plans for even larger capacities.
- ▪Huawei's new SSDs utilize Die-on-Board packaging to achieve high capacities of 61.44 TB and 122.88 TB.
- ▪The DoB technology provides a 33% improvement in capacity density over traditional methods.
- ▪Huawei's OceanStor Pacific 9926 can achieve 4.42 PB of raw capacity using its 122.88 TB SSDs.
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