Huawei touts chip breakthrough to shorten gap with TSMC
Huawei Technologies has announced a new pathway to close the gap with TSMC in semiconductor manufacturing. The company plans to produce 1.4-nanometer chips by 2031 using its own LogicFolding technology, which does not rely on ASML's advanced lithography machines. This development could significantly enhance Huawei's chipmaking capabilities and challenge existing industry norms.
- ▪Huawei aims to produce 1.4-nanometer chips by 2031 using its LogicFolding technology.
- ▪Currently, there is a five-year gap between TSMC's capabilities and Huawei's production.
- ▪Shares of major Chinese chip firms rose significantly following Huawei's announcement.
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Huawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.Recommended Video Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semiconductor Manufacturing International Corp. can produce. Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said in a rare public appearance during a chip conference on Monday, while TSMC has said that it will begin mass production of the same product in 2028.
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