Huawei Touts Chip Breakthrough to Shorten Gap with TSMC
Huawei Technologies Co. announced a new method to reduce the technological gap with Taiwan Semiconductor Manufacturing Co. (TSMC) in semiconductor production. The company plans to produce 1.4-nanometer chips by 2031 using its proprietary 'LogicFolding' technology. Currently, there is a five-year difference in capabilities between TSMC and Huawei's manufacturing partner, Semiconductor Manufacturing International Corp.
- ▪Huawei has developed a new pathway to shorten its gap with TSMC.
- ▪The company aims to produce 1.4-nanometer chips by 2031.
- ▪There is currently a five-year gap in semiconductor capabilities between TSMC and Huawei's manufacturing partner.
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TechnologyAsiaHuawei Touts Chip Breakthrough to Shorten Gap With TSMCFacebookXLinkedInEmailLinkGiftFacebookXLinkedInEmailLinkGiftGift this articleContact us:Provide news feedback or report an errorConfidential tip?Send a tip to our reportersSite feedback:Take our SurveyNew WindowFacebookXLinkedInEmailLinkGiftBy Bloomberg NewsMay 25, 2026 at 1:30 AM UTCUpdated on May 25, 2026 at 9:06 AM UTCBookmarkSaveHuawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semiconductor…
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