Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint
Huawei has developed a new 122TB SSD using innovative Die-on-Board packaging technology to overcome U.S. sanctions on 3D NAND chips. This technology allows the company to increase storage density by mounting more NAND dies directly on the PCB. Despite challenges, Huawei continues to innovate and maintain its position as a leading tech company in China and globally.
- ▪Huawei's new SSDs come in capacities of 61.44TB and 122.88TB, with a 245TB variant expected in the future.
- ▪The company uses Die-on-Board packaging to circumvent limitations imposed by U.S. sanctions on high-layer-count 3D NAND chips.
- ▪Huawei's approach allows for increased storage density and cost-effectiveness compared to traditional NAND packaging.
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PC Components Storage SSDs Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint News By Jowi Morales published 23 May 2026 Necessity is the mother of invention. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. (Image credit: Shutterstock) Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Share this article 0 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Huawei just released a new storage device designed for AI inference and data centers with capacities of 61.44TB and 122.88TB; a 245TB variant is expected to arrive in the future.
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