Huawei develops 122TB SSD using innovative packaging amid US export controls
Huawei has developed a 122TB SSD using a new packaging technique called Die-on-Board (DoB) to enhance storage density. This innovation comes in response to US export controls that limit access to advanced memory chips. The company is also reportedly working on a 245TB variant and integrating the 122TB drives into its storage systems.
- ▪Huawei unveiled enterprise SSDs with capacities of 61.44 TB and 122.88 TB at the Huawei ID Forum 2026 in Paris.
- ▪The Die-on-Board packaging technique allows for a 33% increase in storage density by mounting NAND flash dies directly onto the circuit board.
- ▪Huawei is already integrating the 122.88 TB drives into its OceanStor Pacific 9926 all-flash array.
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Huawei develops 122TB SSD using innovative packaging amid US export controls Cut off from the world's most advanced memory chips, Huawei engineered around the problem with a packaging trick that boosts storage density by 33%. Share Add us on Google by Editorial Team May. 24, 2026 window.sevioads = window.sevioads || []; var sevioads_preferences = []; sevioads_preferences[0] = {}; sevioads_preferences[0].zone = "01f21ccf-2092-46b1-9ac7-8c44cc782e0f"; sevioads_preferences[0].adType = "native"; sevioads_preferences[0].inventoryId = "c5700508-581b-472c-8fdd-a931cdbfc8e1"; sevioads_preferences[0].accountId = "1e47efc1-ec2d-4fca-a8b9-354e249e5095"; sevioads.push(sevioads_preferences); When you can’t get the best chips, you figure out how to fit more of the chips you can get.
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